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UQQ Series
Wide Input Range Single Output DC-DC Converters
TECHNICAL NOTES
Soldering Guidelines
Murata Power Solutions recommends the speci?cations below when installing these
converters. These speci?cations vary depending on the solder type. Exceeding these
speci?cations may cause damage to the product. Your production environment may dif-
fer; therefore please thoroughly review these guidelines with your process engineers.
Wave Solder Operations for through-hole mounted products (THMT)
They should be selected for bulk capacitance (at appropriate frequencies),
low ESR, and high rms-ripple-current ratings. The switching nature of
DC-DC converters requires that dc voltage sources have low ac imped-
ance as highly inductive source impedance can affect system stability.
In Figure 2, C BUS and L BUS simulate a typical dc voltage bus. Your speci?c
system con?guration may necessitate additional considerations.
In critical applications, output ripple/noise (also referred to as periodic and
random deviations or PARD) can be reduced below speci?ed limits using
For Sn/Ag/Cu based solders:
For Sn/Pb based solders:
?ltering techniques, the simplest of which is the installation of additional
Maximum Preheat Temperature
Maximum Pot Temperature
Maximum Solder Dwell Time
115° C.
270° C.
7 seconds
Maximum Preheat Temperature
Maximum Pot Temperature
Maximum Solder Dwell Time
105° C.
250° C.
6 seconds
external output capacitors. Output capacitors function as true ?lter ele-
ments and should be selected for bulk capacitance, low ESR, and appropri-
ate frequency response.
All external capacitors should have appropriate voltage ratings and be
Removal of Soldered UQQ’s from Printed Circuit Boards
Should removal of the UQQ from its soldered connection be needed, thor-
oughly de-solder the pins using solder wicks or de-soldering tools. At no time
should any prying or leverage be used to remove boards that have not been
properly de-soldered ?rst.
Input Source Impedance
UQQ converters must be driven from a low ac-impedance input source. The
located as close to the converter as possible. Temperature variations for all
relevant parameters should be taken into consideration. OS-CON TM organic
semiconductor capacitors (www.sanyo.com) can be especially effective for
further reduction of ripple/noise. The most effective combination of external
I/O capacitors will be a function of line voltage and source impedance, as
well as particular load and layout conditions.
DC-DC’s performance and stability can be compromised by the use of highly
inductive source impedances. The input circuit shown in Figure 2 is a practical
solution that can be used to minimize the effects of inductance in the input
+SENSE
+VOUT
7
8
traces. For optimum performance, components should be mounted close to the
DC-DC converter.
I/O Filtering, Input Ripple Current, and Output Noise
All models in the UQQ Series are tested/speci?ed for input ripple current (also
–VOUT
–SENSE
4
5
C1
C2
SCOPE
R LOAD
called input re?ected ripple current) and output noise using the circuits and
layout shown in Figures 2 and 3. External input capacitors (C IN in Figure 2)
serve primarily as energy-storage elements.
C1 = 1μF
C2 = 10μF TANTALUM
LOAD 2-3 INCHES (51-76mm) FROM MODULE
TO
OSCILLOSCOPE
CURRENT
Figure 3. Measuring Output Ripple/Noise (PARD)
+
L BUS
PROBE
1
+VIN
V IN
–
C BUS
C IN
3
–VIN
C IN = 33μF, ESR < 700m Ω @ 100kHz
C BUS = 220μF, ESR < 100m Ω @ 100kHz
L BUS = 12μH
Figure 2. Measuring Input Ripple Current
www.murata-ps.com/support
MDC_UQQ.D03 Page 13 of 18
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